CHIPSingle Crystal Pulling Furnace (CZ)
Czochralski furnace growing monocrystalline silicon ingots for wafer starting material.
- CZ pull, 6–12 in class
- Argon / vacuum chamber
- Diameter and resistivity on request
Wafer & chip tools
Wafers
on process.
CZ furnaces, lithography, PVD, lapping and plasma etch for front-end chip work. Quoted against wafer diameter and process node.
7catalogue machines
1 dayquote response
Catalogue
CHIP Equipment
CZ furnaces, lithography, PVD, lapping and plasma etch for front-end chip work. Quoted against wafer diameter and process node.
CHIP
CHIPFront-End Wafer Fabrication Set
Grouped core tools for front-end wafer lines: clean handling, process modules and metrology interfaces.
- 150 / 200 / 300 mm
- Front-end process modules
- Quoted as a line package
CHIPPhysical Vapor Deposition (Sputter)
Magnetron sputter tool depositing metal and barrier films on wafers.
- Al / Cu / Ti / TiN
- Single or cluster PVD
- Wafer 150–300 mm
CHIPSilicon Ingot Wire Saw
Multi-wire saw slicing CZ ingots into wafers with controlled thickness and TTV.
- Multi-wire slurry / diamond
- Ingot 6–12 in
- TTV / warp control
CHIPWafer Lapping & Polishing Machine
Double-side lapping and CMP-style polish to bring sliced wafers to spec thickness and roughness.
- Lapping + polish
- 150 / 200 / 300 mm
- Ra / TTV to drawing
CHIPLithography Scanner / DUV·EUV Stepper
Stepper / scanner exposing wafer resist with DUV or EUV optics for critical layers.
- DUV / EUV class
- Overlay to process node
- 200 / 300 mm wafers
CHIPDry Plasma Etcher
Dry plasma etch for dielectric and metal layers with anisotropic profiles.
- RIE / ICP plasma
- Oxide / poly / metal
- Single-wafer chamber
Capabilities
Wafer / chip tools
01
Crystal & slice
CZ, wire saw and polish quoted to ingot and wafer diameter.
02
Front-end modules
Lithography, PVD and plasma etch to process node.
03
FAT & manuals
Factory acceptance and English operating files.
04
Export packing
Crate packing for precision tools.
Facility
Front-end tool bays
Wafer tools prepared for FAT.
Quoted to specification
Send drawings or process windows. The team replies within one business day.
Quality
Shipped with the process file
Utility drawings and FAT records travel with the tool.
- Factory records on request
- Export packing
- English documentation
HANDOVER
01Specification checkAgainst drawing or process window
02Packing listLot and serial numbers
Request a quotation
Send your wafer process specification.
Wafer diameter, node and destination. Reply within one business day.